How Technological Innovation Influence Development of Dynamic Capability : The Case Study of ASML Corporation.

碩士 === 國立臺南大學 === 經營與管理學系科技管理碩士在職專班 === 102 === Convenience of life science and technology, leading to smart technology products dependent increase in demand caused explosion, catalyzed the rapid evolution of semiconductor manufacturing technology. Wafer production capacity to follow Moore's La...

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Bibliographic Details
Main Authors: Liu, Tsung-Yu, 柳宗佑
Other Authors: Liu, Tzu-Hsin
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/43988009690947568404
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Summary:碩士 === 國立臺南大學 === 經營與管理學系科技管理碩士在職專班 === 102 === Convenience of life science and technology, leading to smart technology products dependent increase in demand caused explosion, catalyzed the rapid evolution of semiconductor manufacturing technology. Wafer production capacity to follow Moore's Law continues to grow, the demand for computing power also increased chip complexity of the design harder. Rapidly changing environment in the semiconductor industry, the fierce market competition, new technologies continue to be improved and developed, and equipment suppliers only technically innovative research and development in order to maintain a competitive advantage in the marketplace. In this study, the company from its inception in 1984, continued technology development for lithography equipment. In historical perspective lithography equipment for 30 years of success, to analyze the business cycle in the semiconductor uncertainties. The enterprise continues to invest R & D, focusing on technological innovation, the ability to choose from a dynamic technology strategy and implementation possibility. Instead, identify their dynamic capabilities via its own resources and abilities to obtain the relevant core technology suppliers through mergers and acquisitions to accelerate the growth of dynamic capabilities within the enterprise, continued for wafer manufacturing technology development. In the competitive environment of lithography equipment industry enterprises use their own resources and capabilities to create competitive advantage. And maintain the manufacturing cost advantages through the most advanced manufacturing technology IC chip manufacturers and semiconductor process successfully branched out into the next generation miniature.