| Summary: | 碩士 === 國立臺南大學 === 機電系統工程研究所 === 103 === The energy resources of nature are limited. According to the report from the International Energy Agency (IEA), there is 19% of the energy used for illumination. It's well known that LED is an excellent choice to instead the incandescent lamp for saving energy. But the other question comes out while the high power LED is applied. There is only about 20% of the input power converts to light energy, the rest of power is convers to heat which should be carry out from the LED chips, otherwise, the high heat concentration results in a serious problem to decrease LED working. The most important issue of the LED research is to find a potential design of heat removal and solve the problem of LED over-heating. The purpose of this study is to discuss the heat removal ability of the aluminum-acetone flat plate heat pipe by applying in the high power LED array. The aluminum-acetone flat plate heat pipe is innovative proposed by our team. The high power LEDs with and without heat pipe cooling module is compared. The heat removal efficiency of the cooling module of the aluminum-acetone flat plate heat pipe reaches 92.09% and drops the junction temperature of LED about 36 °C. The thermal resistance is discussed. The numerical simulation is build and optimized by SCGM (simplified conjugated gradient method). The cooling module of the aluminum-acetone flat plate heat pipe has proven to be effective in solving the heat concentration problems associated with the LED chips. In short, the phase change cooling module will apply on the electronic component of high heat concentration for more effective cooling method.
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