Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
碩士 === 國立清華大學 === 工程與系統科學系 === 103 === 因申請專利緣故,資料延後公開
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ndltd-TW-103NTHU55930792019-05-15T22:18:05Z http://ndltd.ncl.edu.tw/handle/b8rq6b Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules 發光二極體模組中銀鈀合金打線在電遷移實驗下的微結構及形貌之研究 Hsu, Tzu Yu 徐子祐 碩士 國立清華大學 工程與系統科學系 103 因申請專利緣故,資料延後公開 Ouyang, Fan Yi 歐陽汎怡 2015 學位論文 ; thesis 110 en_US |
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NDLTD |
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en_US |
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Others
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NDLTD |
description |
碩士 === 國立清華大學 === 工程與系統科學系 === 103 === 因申請專利緣故,資料延後公開
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author2 |
Ouyang, Fan Yi |
author_facet |
Ouyang, Fan Yi Hsu, Tzu Yu 徐子祐 |
author |
Hsu, Tzu Yu 徐子祐 |
spellingShingle |
Hsu, Tzu Yu 徐子祐 Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules |
author_sort |
Hsu, Tzu Yu |
title |
Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules |
title_short |
Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules |
title_full |
Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules |
title_fullStr |
Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules |
title_full_unstemmed |
Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules |
title_sort |
microstructure evolution of ag-4pd alloy wire bonded on al-si metallization under electromigration test in light-emitting diode (led) modules |
publishDate |
2015 |
url |
http://ndltd.ncl.edu.tw/handle/b8rq6b |
work_keys_str_mv |
AT hsutzuyu microstructureevolutionofag4pdalloywirebondedonalsimetallizationunderelectromigrationtestinlightemittingdiodeledmodules AT xúziyòu microstructureevolutionofag4pdalloywirebondedonalsimetallizationunderelectromigrationtestinlightemittingdiodeledmodules AT hsutzuyu fāguāngèrjítǐmózǔzhōngyínbǎhéjīndǎxiànzàidiànqiānyíshíyànxiàdewēijiégòujíxíngmàozhīyánjiū AT xúziyòu fāguāngèrjítǐmózǔzhōngyínbǎhéjīndǎxiànzàidiànqiānyíshíyànxiàdewēijiégòujíxíngmàozhīyánjiū |
_version_ |
1719128776383660032 |