Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules

碩士 === 國立清華大學 === 工程與系統科學系 === 103 === 因申請專利緣故,資料延後公開

Bibliographic Details
Main Authors: Hsu, Tzu Yu, 徐子祐
Other Authors: Ouyang, Fan Yi
Format: Others
Language:en_US
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/b8rq6b
id ndltd-TW-103NTHU5593079
record_format oai_dc
spelling ndltd-TW-103NTHU55930792019-05-15T22:18:05Z http://ndltd.ncl.edu.tw/handle/b8rq6b Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules 發光二極體模組中銀鈀合金打線在電遷移實驗下的微結構及形貌之研究 Hsu, Tzu Yu 徐子祐 碩士 國立清華大學 工程與系統科學系 103 因申請專利緣故,資料延後公開 Ouyang, Fan Yi 歐陽汎怡 2015 學位論文 ; thesis 110 en_US
collection NDLTD
language en_US
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 工程與系統科學系 === 103 === 因申請專利緣故,資料延後公開
author2 Ouyang, Fan Yi
author_facet Ouyang, Fan Yi
Hsu, Tzu Yu
徐子祐
author Hsu, Tzu Yu
徐子祐
spellingShingle Hsu, Tzu Yu
徐子祐
Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
author_sort Hsu, Tzu Yu
title Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
title_short Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
title_full Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
title_fullStr Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
title_full_unstemmed Microstructure evolution of Ag-4Pd alloy wire bonded on Al-Si metallization under Electromigration test in light-emitting diode (LED) modules
title_sort microstructure evolution of ag-4pd alloy wire bonded on al-si metallization under electromigration test in light-emitting diode (led) modules
publishDate 2015
url http://ndltd.ncl.edu.tw/handle/b8rq6b
work_keys_str_mv AT hsutzuyu microstructureevolutionofag4pdalloywirebondedonalsimetallizationunderelectromigrationtestinlightemittingdiodeledmodules
AT xúziyòu microstructureevolutionofag4pdalloywirebondedonalsimetallizationunderelectromigrationtestinlightemittingdiodeledmodules
AT hsutzuyu fāguāngèrjítǐmózǔzhōngyínbǎhéjīndǎxiànzàidiànqiānyíshíyànxiàdewēijiégòujíxíngmàozhīyánjiū
AT xúziyòu fāguāngèrjítǐmózǔzhōngyínbǎhéjīndǎxiànzàidiànqiānyíshíyànxiàdewēijiégòujíxíngmàozhīyánjiū
_version_ 1719128776383660032