Architecture and Method for Testing Power-Delivery TSVs in 3D-ICs
碩士 === 國立清華大學 === 電機工程學系 === 103 === Many TSVs in a 3D IC are not used for signal transmission but for power delivery. Techniques needed to detect them have not been studied in-depth in the literature. In this work, we present a test method for power-delivery TSVs, by embedding ring-oscillator (RO)...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51615789759658219384 |