Effects of ultrasonic agitation and electrolyte additives on microstructure and mechanical property of electroplated Cu films
碩士 === 國立清華大學 === 材料科學工程學系 === 103 === Electroplating is a main-stream process used to fill the metal layer of integrated circuits. However, owing to the complication of the circuit structure, the metal layer may suffer local stress concentration, leading to device failure. Nanotwinned Cu that has h...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22837010330085172303 |