The research and development of 3D system package for wireless bio-medical application

• Main Authors: Huei-Jun Wang, 王(日慧)竣
• Other Authors: Wen-Cheng Kuo
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/25741127014538417075

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 103 === The purpose of this research is the development of wireless and biocompatible flexible type of biomedical systems. Use the Parylene for flexible substrate and compatible with wireless coil, SMD chip capacitors and ECG chip complete system integration by 3D package, with skin fit. After the integration of resistance value 3.61 Ω, and the resistance of the inductor coil former integration is 0.57 Ω. This study of 3D package process required on the wafer, using ICP etching the wafer with a close fit. Then and Parylene deposited into wafers, When the wafer is placed in the hole and because of the close fit, There may be resulting in gold can not be turned on, so that the Quality is reduced.Therefore, this study added flip-chip packaging technology, use of the silver paste (EPO-TEK H20E) making dispensing bumps, Complete the chip and substrate interconnect, resistance after integration of the value 49.2 Ω, The resistance of the inductor coil before the consolidation is 45.7 Ω, to prove the feasibility of the flip-chip package. In view of the system prior to the completion of the laboratory system for soaking accelerated life test found Parylene inadequate adaptation. Therefore, this study added annealing processes. And samples of some of the experimental use of parylene coating inductors. The system is placed in a non-oxidizing oven to a temperature of 200 ° C bake two days. It was found that parylene surface etiolated and embrittlement. Therefore, theis experiment will oven change as parylene machine''s use heating vacuum tube baking and annealing parameters. To design a successful completion of the sample annealed.