The Effect of Ni Addition on The Microstructure and Drop Test Reliability of IC Package in Sn-Ag-Cu Solder
碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 103 === This research is to discuss the effects of the microstructure and interfacial IMC（Intermetallic Compound）layer by adding 0.01 and 0.05wt% Ni into Sn-1Ag-0.5Cu (SAC105) and Sn-1.2Ag-0.5Cu (LF35) lead-free solder balls. Pull test, shear test and board-leve...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66238739485299335865 |