Research on the Enhancement of Detecting Defects for 3D IC Packages Using Scanning Acoustic Microscope Technology
碩士 === 國立彰化師範大學 === 機電工程學系所 === 103 === The purpose of this research is to use of existing ultrasonic wave equipment to enhance the ability of defect detecting for 3D IC advanced packages. Tests were done by various combination of ultrasonic medium density, temperature, and the transducer frequency....
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/40899451459661140480 |