Research on the Enhancement of Detecting Defects for 3D IC Packages Using Scanning Acoustic Microscope Technology

• Main Authors: Cheng-Yu Hsieh, 謝承祐
• Other Authors: Kuan-Jung Chung
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/40899451459661140480

碩士 === 國立彰化師範大學 === 機電工程學系所 === 103 === The purpose of this research is to use of existing ultrasonic wave equipment to enhance the ability of defect detecting for 3D IC advanced packages. Tests were done by various combination of ultrasonic medium density, temperature, and the transducer frequency. Then, the destructive techniques such as cutoff abrasive/grinding, the ion beam cross-sectioning were used to verify the results of experiments, to evaluate the ability of small defect detecting by various factors in advance. The experimental results show that the various medium densities only affect only the change of ultrasonic wave transmission speed. They didn’t provide obvious improvement in the ability of detecting defects. Moreover, temperature and the transducer frequency have great results to enhance the ability of detecting defects of samples. But the later factor needs to close the sample as measuring to increase the probability of damaging samples. The increase of median temperature may represent the practical methodology of improving the ability of detecting defects due to its low cost and easy setup. Overall, the ability of existing ultrasonic wave equipment to detect the defects of 3D IC advanced packages can be improved by different factors corresponding to ultrasonic medium density, temperature, and the transducer frequency.