| Summary: | 碩士 === 國立中央大學 === 光電科學與工程學系 === 103 === By the principle of the fluid of heat pipe heated in the high temperature
area, the density and the ration become lower; therefore, the temperature
goes higher. On the contrary, the high density and ration of the cold fluid
goes down, replacing the rising part. The cold fluid goes up again when
heated. The alternating phenomena lead to convective transfer of capacity
formation. According the principle, the thermal cycling is carried out on
lamps and lanterns. In addition, each of the modulation factor and
parameter is set during simulation. The result of simulation is received by
using the simulation software, COMSOL Multiphysics. To analyze the
result of each group helps to understand how to obtain the most advanced
heat pipe device and to lower the highest temperature and LED lamp. The
highest temperature is 46.9℃ in the beginning of designed simulation.
temperature of LED chip, 40.8℃, and aluminum substrate , 28.2℃～30℃,
and the surface of lamps and lanterns, 30℃～32℃. Therefore, the highest
temperature decreases on the aluminum substrate of the main part of lamps
and lanterns and the surface of LED. Consequently, the temperature of
aluminum substrate declines dramatically to attain the fine effects of heat
dissipation, beneficial to the cooling design of LED.
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