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• Main Authors: Kun-Tsai Wu, 吳昆財
• Other Authors: Shu-San Hsiau
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/02818152450084337111

碩士 === 國立中央大學 === 機械工程學系在職專班 === 103 === The light-emitting diodes (LED) in the application of solid-state lighting is interested. LEDs one can be used as indoor lighting, outdoor lighting, backlighting, daytime running light, traffic light and the other industries, etc.. When the trend of the increasing popularity of LED applications, the efficiency of LED has also been increased gradually. Due to only 30% of the input power been converted to light and nearly 70% been converted to heat. The thermal management issue of the LEDs become important and crucial. To reduce the junction temperature and thermal resistance, one important issue is copper foil layer design of Printed Circuit Board. The main purpose of this study is to design an optimizing Metal Core Printed Circuit Board in order to reduce the heat from the chipset. This work investigates the cooling ability of the MCPCB by thermal simulation analysis and thermal experiments of LED. This study uses commercial software, SolidWorks Flow Simulation, to analyze the temperature field and the results are compared with experimental data to verify the simulation analysis. Six different copper foil design of MCPCB were compared. The junction temperature and thermal resistance, were used to evaluate the thermal performance on high power LED module in this study. From the thermal simulation analysis and thermal experiments results, the LED module showed a minimum junction temperature and thermal resistance at about 65.73°C and 17.21°C/W due to the thermoelectric coupling design and extended area design of the copper foil layer in Type-3. According to the simulation results and temperature measurement, we can make sure that the substrate geometry has directly effects on the junction temperature and thermal resistance of an LED.