none
碩士 === 國立中央大學 === 機械工程學系 === 103 === In the semiconductor industry , it is often use Smart-Cut to manufacture SOI , and the process as follow : wafer cleaning , the hydrogen implantation , wafer bonding , annealing and chemical mechanical polishing. The above steps , the wafer bonding is needed to h...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/11172680442679667003 |