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碩士 === 國立中央大學 === 機械工程學系 === 103 === In the semiconductor industry , it is often use Smart-Cut to manufacture SOI , and the process as follow : wafer cleaning , the hydrogen implantation , wafer bonding , annealing and chemical mechanical polishing. The above steps , the wafer bonding is needed to h...
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| Format: | Others |
| Language: | zh-TW |
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2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11172680442679667003 |
| Summary: | 碩士 === 國立中央大學 === 機械工程學系 === 103 === In the semiconductor industry , it is often use Smart-Cut to manufacture SOI , and the process as follow : wafer cleaning , the hydrogen implantation , wafer bonding , annealing and chemical mechanical polishing. The above steps , the wafer bonding is needed to hold the wafer in a high temperature environment in which the bonding strength of the thin film up to standard before the transfer. Traditional heating problems of thermal stress and long time. We hope using microwave can solve problems.
This study using atmospheric nitrogen plasma systems to activate silicon surface and microwave Si/Si bonding pairs. Finally , in addition to TEM , the TEM specimen production process wherein the step of detecting the bonding strength.
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