Effect of polishing processes on the total thickness variation of sapphire substrates

碩士 === 國立交通大學 === 平面顯示技術碩士學位學程 === 103 === The purpose of this study is to investigate the effect of polishing processes on the Total Thickness Variation of sapphire substrates. We conducted the five experimental parameters: Polishing Pressure, Carrier Type, Polishing Pad, Pressure Pad and the C...

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Bibliographic Details
Main Authors: Chen, Adams, 陳世和
Other Authors: Wu,YewChung Sermon
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/73350743719774759957

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