Effect of polishing processes on the total thickness variation of sapphire substrates
碩士 === 國立交通大學 === 平面顯示技術碩士學位學程 === 103 === The purpose of this study is to investigate the effect of polishing processes on the Total Thickness Variation of sapphire substrates. We conducted the five experimental parameters: Polishing Pressure, Carrier Type, Polishing Pad, Pressure Pad and the C...
Main Authors: | Chen, Adams, 陳世和 |
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Other Authors: | Wu,YewChung Sermon |
Format: | Others |
Language: | zh-TW |
Published: |
2015
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Online Access: | http://ndltd.ncl.edu.tw/handle/73350743719774759957 |
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