A Novel Direct Cu-to-Cu Bonded Structure and Reliability Investigation in 3-D Integration
碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 103 === Three-dimensional integrated circuits (3D ICs) provide a new platform to extend beyond “Moore’s law” based on the vertical stacking of chips or wafers with the benefits of small form factor, low RC delay, low power consumption, and various heterogeneous...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5sy6sj |