The Construction of Thermal Measurement and Simulation Platforms for Microprocessors

• Main Authors: Wang, Hsing-Fei, 王星斐
• Other Authors: Tsao, Shiao-Li
• Format: Others
• Language: en_US
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/69839814793355387324

碩士 === 國立交通大學 === 資訊科學與工程研究所 === 103 === Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat, then it need cooling technology to enhance performance and reliability. Because of the enhancement of the technology size, heat dissipation also result in more leakage power consumption and the increasing power will generate more heat then they will influence with each other heavily. Therefore, in order to decrease the temperature of the processors, it is the most important part about how to use Dynamic Thermal Management [24] to control the temperature in recent study topic. We can increase the performance and reliability of processors through efficiently using DTM to manage the operating temperature. To obtain detail thermal distribution of a microprocessor is one of critical tasks for thermal management which improves the reliability, performance, etc. of modern microprocessors significantly. In this thesis, we combine and construct the simulation platform to derive detailed temperature information of a microprocessor by catching the performance counters in each functional unit of the core when we run a program and we would use detailed temperature information to calculate the leakage power which generated from heat. At last, we will construct real time thermal estimation on the real platform with using the infrared camera.