Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder

碩士 === 國立成功大學 === 機械工程學系 === 103

Bibliographic Details
Main Authors:	Zhi-Cheng-Huang, 黃致澄
Other Authors:	Gien-Huang Wu
Format:	Others
Language:	zh-TW
Published:	2015
Online Access:	http://ndltd.ncl.edu.tw/handle/54646199081034473844

id	ndltd-TW-103NCKU5489137
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spelling	ndltd-TW-103NCKU54891372016-05-22T04:44:49Z http://ndltd.ncl.edu.tw/handle/54646199081034473844 Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder 散熱加強型覆晶球柵陣列組合體使用95.5Sn4.0Ag0.5Cu無鉛接點之疲勞壽命分析 Zhi-Cheng-Huang 黃致澄碩士國立成功大學機械工程學系 103 Gien-Huang Wu 吳俊煌 2015 學位論文 ; thesis 105 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立成功大學 === 機械工程學系 === 103
author2	Gien-Huang Wu
author_facet	Gien-Huang Wu Zhi-Cheng-Huang 黃致澄
author	Zhi-Cheng-Huang 黃致澄
spellingShingle	Zhi-Cheng-Huang 黃致澄 Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
author_sort	Zhi-Cheng-Huang
title	Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
title_short	Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
title_full	Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
title_fullStr	Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
title_full_unstemmed	Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder
title_sort	fatigue analysis for thermally enhanced fc-pbga assembly using lead free 95.5sn4.0ag0.5cu solder
publishDate	2015
url	http://ndltd.ncl.edu.tw/handle/54646199081034473844
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Fatigue Analysis for Thermally Enhanced FC-PBGA Assembly using lead free 95.5Sn4.0Ag0.5Cu Solder

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