Formulation of Silver Nanopastes with Energetic Peroxides for Enhanced Cu-to-Cu Bonding
碩士 === 國立成功大學 === 材料科學及工程學系 === 103 === Silver nanopastes have recently demonstrated their promising uses in the low-temperature copper-to-copper (Cu-to-Cu) bonding. Suspension solutions of these nanoparticles allows the ambient process in the material transferring and patterning, while the nanosca...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9aend9 |