On the Spatial Resolution of Standard - and Transmission –EBSD Using Monte Carlo Simulation

• Main Authors: Yen-HuiLi, 李彥慧
• Other Authors: Jui-Chao Kuo
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/44441952377044769963

碩士 === 國立成功大學 === 材料科學及工程學系 === 103 === Due to the recent and rapid development in the field of nano-technology, the analysis techniques are needed at the nano scale. In 2012 Keller firstly demonstrated that EBSD patterns could be acquired from a thin specimen together with EBSD setup in SEM. Suzuki in 2013 also reported that the spatial resolution of aluminum and chromium carbide thin films was influenced by sample tilting angle and accelerating voltage. However, the parameters of the new developed transmission EBSD are still not to be optimized. Therefore, in this study, we investigated the effects of these parameters in transmission-EBSD and standard-EBSD on the spatial resolution using a simulation method. There are two parts in this study: the first part is the spatial resolution simulation of standard-EBSD to compare. The other part is the spatial resolution simulation of transmission-EBSD. Simulation parameters were atomic weight, sample thickness, accelerating voltage and sample tilting angle, in order to understand the optimized spatial resolution in transmission-EBSD system. We used copper, silver and gold as materials for simulation and chose 100, 200 and 300 nm for sample thickness. We selected 15, 25 and 30 kV as accelerating voltage and the sample tilting angles were 20 and 30o. By comparing all the parameters of transmission-EBSD, the best spatial resolution is obtained for copper with the sample thickness 100 nm at 25 kV under the tilting angle 20o. The best spatial resolution of copper is 25 nm longitudinal resolution and 15 nm lateral resolution.