The Study on Optimal Design of Package warpage for LFBGA during the Reflow process by Taguchi Method

The Study on Optimal Design of Package warpage for LFBGA during the Reflow process by Taguchi Method

碩士 === 國立成功大學 === 工程科學系 === 103

Bibliographic Details
Main Authors:	Yu-LungWen, 溫育龍
Other Authors:	Rong-Sheng Chen
Format:	Others
Language:	zh-TW
Published:	2015
Online Access:	http://ndltd.ncl.edu.tw/handle/51036251799715327521

Description
Summary:	碩士 === 國立成功大學 === 工程科學系 === 103