Analysis on the Feasibility Manufacturing Process of the Cu Ball Bonding by 3D Non-linear Dynamic Simulation
碩士 === 國立成功大學 === 工程科學系 === 103 === In recent years, the Cu wire has gradually replaced the Au wire and becomes the popular material for the wire bonding. Thus the process parameters of wire bonding should be affected by the material properties of the Cu wire, i.e., the hardness of the Cu wire is si...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23374158449021364364 |