Effect of SiC modifications on the properties of SiC/inorganic resin composite coating

• Main Authors: Chu-Yun Chung, 鍾居芸
• Other Authors: An-Ya Lo
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/85708977739457488098

碩士 === 國立勤益科技大學 === 化工與材料工程系 === 103 === Silicon carbide (SiC) coating material discussed in this study was developed by physical and chemical modifications. Effects silicon carbide (SiC) concentration have also been studied. High thermal conductivity and good anticorrosive property were obtained by using SiC and inorganic resin composite material as coating layer of aluminum PCB and high brightness LED. Part I: Effect of physical modifications on the properties of SiC/inorganic resin composite coating In this study, highly functional inorganic resin (02-T, Hung M&S company) and SiC monomer were physically dispersed and ground by ball mill or media mill to prepare SiC coating material with a series of different concentration for applying as a SiC coating layer. Microstructure observed in Scanning Electron Microscope (SEM) revealed that the SiC particle size processed by media mill was smaller than by ball mill. The thermal analysis indicate that thermal conductivity of inorganic resin was increased from 9.2 to 51.2 W/(m•K) with addition of 19.4% SiC dispersed by ball mill, which was an increasing of 457% for inorganic resin. Moreover, thermal conductivity of inorganic resin was increased from 9.2 to 23.8 W/(m•K) with addition of 8.3% SiC dispersed by media mill, which was an increasing about 159% for inorganic resin. The result of cross-cut tape test and salt spray test show that best corrosion resistance and good adhesion of proposed composite coating material dispersed by ball mill and media mill was addition of 8.3% and 19.4% SiC, respectively. Part II: Effect of chemical modifications on the properties of SiC/inorganic resin composite coating The chemical modification steps used in this study is described as following. The SiC powder was modified by soaking in alkaline solution in order to generate OH functional group on surface the SiC particles, where the variables are concentration, time, and temperature. The optimal modification conditions were then evaluated by the identification of the powder surface. The chemically modified SiC powder were physically dispersed and ground with highly functional inorganic resin by media mill to prepare chemically and physically modified SiC coating material, in which the SiC concentration was set the same as the best conditions (8.3%, 13.4%, and 19.4%) of physical modification only SiC coating material for comparing various desired tests after film forming. The thermal analysis indicate that thermal conductivity of inorganic resin was increased from 9.2 to 33.5 W/(m•K) (264%) with addition of 19.4％ SiC, which is 164% higher than that of pure SiC coated layer. All coating layer have the best adhesion in the adhesion test. The results of corrosion resistance test indicate that the coating layer has the best corrosion resistance after adding 8.3% SiC into the inorganic resin.