| Summary: | 碩士 === 國立中興大學 === 光電工程研究所 === 103 === Despite having a full range of semiconductor manufacturing and application system,Taiwan is lagging behind in the development of photosensitive resin material. IC material specifications are the key to determining end product quality and this prevents domestic suppliers from providing product with stable specifications and extending their
application into high end products in the future. This program is aimed at developing photosensitive resin technology for low temperature 3D IC applications to improve product performance at the molecular level, including the following: Key material
synthesis technologies: Monomer synthesis, low temperature photosensitive resin molecular design and synthesis production process. High performance photosensitive production film formulation and production: Film coating uniformity and technology
development and materialization/mechanical/electric inspection and analysis/Lithographic process material verification. Establish semiconductor component photoelectric property verification and precision product testing technology. Thus, we plan to accelerate the development of advanced key semiconductor materials that not only comply with the trend for compact and light weight 3C product development, but are also cost effective, replacing conventional packaging materials.
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