The Research and Application of Enhancing the Performance of Rapid Tooling

• Main Authors: Teng-Sheng Chiang, 江騰升
• Other Authors: Chil-Chyuan Kuo
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/8j7k33

碩士 === 明志科技大學 === 機械工程系機械與機電工程碩士班 === 103 === Today, all major businesses are focused on three primary targets, reducing product costs, increasing product yield rate and shortening production time. Traditional metal and resin are expensive and the surface is unsmooth when it hardens, which influences the product yield rate. Therefore, with the goal of improving flatness and reducing cost in mold, this particular research focuses on manufacturing stainless steel mold and traditional epoxy resin mold by utilizing hybrid rapid tooling. Furthermore, in order to reduce the manufacturing time, this research utilizes three types of metallic materials to make the hybrid rapid tooling and traditional epoxy resin mold. The mold ejection time were also measured for hot embossing of each materials. According to the experiment, hybrid rapid tooling can improve the production cost, yield rate and manufacturing time but there is a concentrated stress problem between the filling gate and the backing moldboard indentations during hot embossing which reduces the life span of the mold. This research added chamfers to the area of backing moldboard with concentrated stress to improve this issue. From the result of the research, the flatness of the hybrid rapid tooling is 46.38 % better than the traditional epoxy resin mold and the cost of materials required to manufacture the mold is reduced by 69.61 %. Hybrid rapid tooling with aluminum backing moldboard reduces mold ejection time by 95 minutes as compared to the traditional epoxy resin, increasing manufacturing efficiency by 68 %. Molds with chamfers added reduces concentrated stress by 40.8 %, increasing the mold life span by 126 %. Therefore, the method proposed by this research actually enhances the effectiveness of rapid tooling.