Formation and elimination of voids in solder joints of Surface mounting technology passive components
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 103 === Passive components are mounting and soldered on the PCB via Surface mounting technology (SMT) and the solder joints will be checked by automated optical inspection (AOI). Wetting conditions and height of the solder determine the reliable solder join...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43641095144996354453 |