Patent Analysis to Explore 3D Printing Technology
碩士 === 國立高雄應用科技大學 === 模具工程系 === 103 === The global economic has been recovered since the end of 20 century. The new and developing technologies is impacting the industrials which are related to them. One of these technologies is “3D printing” ,which has received widespread media and industrial circl...
Main Authors: | Chih-Chung Ho, 賀志忠 |
---|---|
Other Authors: | Cheung-Hwa Hsu |
Format: | Others |
Language: | zh-TW |
Published: |
2015
|
Online Access: | http://ndltd.ncl.edu.tw/handle/st67b4 |
Similar Items
-
Using networks in patent exploration: application in patent analysis: the democratization of 3D printing
by: David Reymond, et al.
Published: (2014-08-01) -
An Exploratory Patent Analysis of 3D Printing Technology for Application on Tissue Engineering
by: Keiko Nakanishi, et al.
Published: (2014) -
A Patent Analysis for Exploring TSV Technology Development of 3D IC
by: Wei-Wen Lin, et al.
Published: (100) -
Visualization Methods for Patent Analysis to Explore Enterprise Technological Deployment and R&D Strategies
by: Chih-hsi Kao, et al.
Published: (2011) -
Using Patent Analysis to Explore Patent Management:Taking Touch-Panel Technology in Taiwan as an Example
by: Chung-wen Chen, et al.
Published: (2013)