Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process
碩士 === 逢甲大學 === 纖維與複合材料學系 === 103
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| Language: | zh-TW |
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2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40438364220370550753 |
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ndltd-TW-103FCU052920292015-12-19T04:04:07Z http://ndltd.ncl.edu.tw/handle/40438364220370550753 Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process 半導體球型陣列(BGA)製程 失效分析研究 林 文 欽 碩士 逢甲大學 纖維與複合材料學系 103 陳文正 2015 學位論文 ; thesis 55 zh-TW |
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NDLTD |
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zh-TW |
| format |
Others
|
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NDLTD |
| description |
碩士 === 逢甲大學 === 纖維與複合材料學系 === 103 |
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陳文正 |
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陳文正 林 文 欽 |
| author |
林 文 欽 |
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林 文 欽 Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process |
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林 文 欽 |
| title |
Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process |
| title_short |
Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process |
| title_full |
Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process |
| title_fullStr |
Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process |
| title_full_unstemmed |
Ball Grid array (BGA) Failure analysis for Semiconductor Packaging Process |
| title_sort |
ball grid array (bga) failure analysis for semiconductor packaging process |
| publishDate |
2015 |
| url |
http://ndltd.ncl.edu.tw/handle/40438364220370550753 |
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AT línwénqīn ballgridarraybgafailureanalysisforsemiconductorpackagingprocess AT línwénqīn bàndǎotǐqiúxíngzhènlièbgazhìchéngshīxiàofēnxīyánjiū |
| _version_ |
1718154154834132992 |