Increasing the bond strength and reliability of chips and flex substrates assembly with non-conductive paste by surface activated technology
碩士 === 中山醫學大學 === 職業安全衛生學系碩士班 === 103 === Argon plasma was selected to perform the surface activation on flex substrates in this study. The argon plasma activation was expected to remove the surface contaminants, and then to reduce the bonding barrier between flex substrates and the non-conductive p...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28096700881178243545 |