Inhibiting Intermetallic Compound Growth by Minor Ga or Pd Addition And Electromigration Failure by Introducing PdSn4 Layer in Lead-free Solder Joints
碩士 === 國立中正大學 === 化學工程研究所 === 103 === With the development of miniaturization in electronic products, ENIG has been regarded as a surface treatment in recent years. The black pad problem was usually occur in ENIG technique and Ni will dissolve into the solder under electron current stressing, the el...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/js76ca |