| Summary: | 碩士 === 國立雲林科技大學 === 機械工程系 === 102 === This subject is to simulate the computer CPU cooling heat dissipation system，Using electrical heater to simulate of the four-walled hot from the CPU and Thermal conductivity by copper surface,using FC-72 tropical work on the surface of the copper,Through modification of copper surface area of contact with the liquid, the evaporator angle, height, and the system angle etc, the stand or fall of its cooling efficiency.
The results show that when the fluid and surface contact area of the more its thermal efficiency better.Gap take into account the d_threshold, the d_threshold from the equation calculated results with the experimental results of the same d_threshold.Changing the angle of evaporator, its gravity pressure drop is discussed and the effect of buoyancy effect, can learn buoyancy effect works best when 90 degrees, so in 90 degrees when its heat dissipation efficiency after 0 degrees.
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