| Summary: | 碩士 === 大同大學 === 機械工程學系(所) === 102 === In recent years, the power increasing of IGBT module also induces the demand for heat dissipation itself especially in the electronic vehicle. If the temperature of IGBT is higher than its designing limit, the performance of vehicle may be decayed and even shut down. Then, it needs to pay more cost for fix
This study explores three-dimensional thermal dissipation of IGBT module by numerical simulation. The symmetry effect with three kinds of module is compared. Also, the effect due to thermal conductivity, fin height and fin thickness are studied by air forced convection. The thermal resistance and efficiency of the IGMT module are calculated to find its cooling performance. According to the results shown in this study, the best arrangement to thermal dissipation and thermal resistance and efficiency is wind velocity with four meters per second. For the purpose of energy saving, however, the wind velocity with one meter per second was adopted in this study In addition, changing spreader thermal conductivity has less influence on cooling effect。
Finally, the thermal performance of IGBT module with six different sizes of fin height and four different kinds of fin thickness are analyzed for comparison under the same wind velocity. It is found that changing fin height has more influence on cooling effect than fin thickness. The best cooling effect occurs at the fin thickness 0.5mm and fin height 25mm. Nevertheless, the fin thickness 0.5mm and fin height 21mm can be considered for the purpose of cost reduction.
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