The Study of the Selective Electroplating of Cu Bumps on Si Substrate
碩士 === 淡江大學 === 化學工程與材料工程學系碩士班 === 102 === The purpose of the study is developing the selective electroplating technique. For the manufacture of semiconductor, we can successfully fabricate the copper bumps on the pre-defined pattern seed layer without using barriers by the selective electroplating...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u4n9s9 |