Experimental Study on the Moisture Control in Wafer Carrier

博士 === 國立臺北科技大學 === 冷凍空調工程系所 === 102 === This study is designated to experimentally determine the effect of varied clean dry air (CDA) purging rate on the alteration rate of moisture content inside an alpha version of 450 mm polycarbonate (PC) Front Opening Unified Pod (FOUP), and to investigate the...

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Main Authors: Chun-Yong Khoo 邱俊榮, 邱俊榮
Other Authors: Shih-Cheng Hu 胡石政
Format: Others
Language:en_US
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/9swt7k
id ndltd-TW-102TIT05703040
record_format oai_dc
spelling ndltd-TW-102TIT057030402019-05-15T21:42:33Z http://ndltd.ncl.edu.tw/handle/9swt7k Experimental Study on the Moisture Control in Wafer Carrier 晶圓盒濕度控制之實驗研究 Chun-Yong Khoo 邱俊榮 邱俊榮 博士 國立臺北科技大學 冷凍空調工程系所 102 This study is designated to experimentally determine the effect of varied clean dry air (CDA) purging rate on the alteration rate of moisture content inside an alpha version of 450 mm polycarbonate (PC) Front Opening Unified Pod (FOUP), and to investigate the prospect of liquid crystal polymer (LCP) as a new, alternative base material for 300 mm FOUP. The 450 mm PC FOUP which fully loaded with 25 pieces of dummy wafers was purged for 30 minutes with the varied CDA purging rates range of 30~360 L/min (LPM) via the two rear inlet ports. The decay of moisture in the FOUP was measured in situ using temperature and humidity data loggers and was analyzed. Moisture content less than 5% relative humidity within the FOUP ambient was served as key evaluation factor. The results showed that higher purging rate of CDA demonstrates favorable moisture depletion rate within the gaps formed between wafers, i.e. 150 LPM and 180 LPM cases. The middle zone (wafer slot 13) was the spot that the purge air difficult to reach. The convection of purging gas is the dominant mode of mass transfer in the early stage of the purging process, and later replaced by the diffusion of purging gas into the tiny spaces between wafer slots. Meanwhile, with the similar settings and requirement, the moisture depletion in the alpha version LCP FOUP, the commercial 300 mm PC FOUP, and the commercial Barrier FOUP were examined but with the varied CDA purging rates range of 15~105 L/min (LPM). Different base material of 300 mm FOUP does show significant effects on purging efficiency. The 300 mm barrier FOUP presents fast moisture decay rates within short times but vice versa for 300 mm PC FOUP. The 300 mm LCP FOUP demonstrates the promising moisture decay rates that are highly comparative to the results of Barrier FOUP, although slightly more time was required to reach the threshold limit of 5% RH when the FOUP was fully loaded. Shih-Cheng Hu 胡石政 胡石政 2014 學位論文 ; thesis 73 en_US
collection NDLTD
language en_US
format Others
sources NDLTD
description 博士 === 國立臺北科技大學 === 冷凍空調工程系所 === 102 === This study is designated to experimentally determine the effect of varied clean dry air (CDA) purging rate on the alteration rate of moisture content inside an alpha version of 450 mm polycarbonate (PC) Front Opening Unified Pod (FOUP), and to investigate the prospect of liquid crystal polymer (LCP) as a new, alternative base material for 300 mm FOUP. The 450 mm PC FOUP which fully loaded with 25 pieces of dummy wafers was purged for 30 minutes with the varied CDA purging rates range of 30~360 L/min (LPM) via the two rear inlet ports. The decay of moisture in the FOUP was measured in situ using temperature and humidity data loggers and was analyzed. Moisture content less than 5% relative humidity within the FOUP ambient was served as key evaluation factor. The results showed that higher purging rate of CDA demonstrates favorable moisture depletion rate within the gaps formed between wafers, i.e. 150 LPM and 180 LPM cases. The middle zone (wafer slot 13) was the spot that the purge air difficult to reach. The convection of purging gas is the dominant mode of mass transfer in the early stage of the purging process, and later replaced by the diffusion of purging gas into the tiny spaces between wafer slots. Meanwhile, with the similar settings and requirement, the moisture depletion in the alpha version LCP FOUP, the commercial 300 mm PC FOUP, and the commercial Barrier FOUP were examined but with the varied CDA purging rates range of 15~105 L/min (LPM). Different base material of 300 mm FOUP does show significant effects on purging efficiency. The 300 mm barrier FOUP presents fast moisture decay rates within short times but vice versa for 300 mm PC FOUP. The 300 mm LCP FOUP demonstrates the promising moisture decay rates that are highly comparative to the results of Barrier FOUP, although slightly more time was required to reach the threshold limit of 5% RH when the FOUP was fully loaded.
author2 Shih-Cheng Hu 胡石政
author_facet Shih-Cheng Hu 胡石政
Chun-Yong Khoo 邱俊榮
邱俊榮
author Chun-Yong Khoo 邱俊榮
邱俊榮
spellingShingle Chun-Yong Khoo 邱俊榮
邱俊榮
Experimental Study on the Moisture Control in Wafer Carrier
author_sort Chun-Yong Khoo 邱俊榮
title Experimental Study on the Moisture Control in Wafer Carrier
title_short Experimental Study on the Moisture Control in Wafer Carrier
title_full Experimental Study on the Moisture Control in Wafer Carrier
title_fullStr Experimental Study on the Moisture Control in Wafer Carrier
title_full_unstemmed Experimental Study on the Moisture Control in Wafer Carrier
title_sort experimental study on the moisture control in wafer carrier
publishDate 2014
url http://ndltd.ncl.edu.tw/handle/9swt7k
work_keys_str_mv AT chunyongkhooqiūjùnróng experimentalstudyonthemoisturecontrolinwafercarrier
AT qiūjùnróng experimentalstudyonthemoisturecontrolinwafercarrier
AT chunyongkhooqiūjùnróng jīngyuánhéshīdùkòngzhìzhīshíyànyánjiū
AT qiūjùnróng jīngyuánhéshīdùkòngzhìzhīshíyànyánjiū
_version_ 1719118442660888576