| Summary: | 碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 102 === According to Moore''s Law, the number of transistors on an integrated circuit can accommodate approximately every 24 months will be doubled But in the 2010 International Technology Roadmap for Semiconductors shows will begin deviation from the law at the end of 2013.Then, the number density of transistors will double every three years is expected to change. Order to make the law will continue to apply, extreme ultraviolet (EUV) lithography is currently regarded as the most effective way. But in extreme ultraviolet lithography technology, there is no material of pellicle capable to apply on EUV lithography. Because the wavelength of light is only 13.5nm, lithography can be smaller. However, due to the shorter waves so the more susceptible to the environment, the irradiation process must be carried out in a vacuum environment. The DUV pellicle which used to isolate the particle is not suitable anymore. Therefore requires a special design and implementation of storage, transportation, pollution prevention mask.
Nitrogen purging has been proven to be effective to prevent the surface of the wafer from the deposition of water vapor in the air. By combining nitrogen purging the vacuum technique over a decade of experience, hoping this technology can achieve the expected results in the removal of water vapor and particulates from the EUV Pod.
In the research, all experiment is using EUV Dual Pod, whose protection is using the filters of the inlet and outlet, and the interval between the carriers to isolate the particle and water vapor. But the contamination which is already entered into the EUV Pod must be removal. Therefore, the experiments in the research to explore: (1) Observing Removal efficiency of humidity and particles after nitrogen purging. (2) Observing Removal efficiency of humidity and particles after vacuum system. (3) Comparing the pros and cons on these both system.
The selected EUV Pod in the study is designed with double pods, mainly protection is depended on the filters which is set on the inner and outter pod, and the gap between the inner and outter pod. These can be isolated water vapor and particle, but the micro-contamination which has entered into EUV Pod must be to remove. Therefore experimental studies investigate: 1. Use nitrogen purging, observe water vapor and particulate removal efficiency. 2 using vacuum system, observe the removal efficiency of water vapor and particles. 3 compare the pros and cons between these systems.
It was found that the pore size of filters will affect purging efficiency a lot. The differences between vacuum system and purging system, is that the cleanliness of the inner box and outer box can be synchronized. About vapor removal efficiency, the vacuum system is better than the purging system. About particle, the numbers that the particle size is smaller than 0.130μm, was a quadratic polynomial related with particle diameter. After pressurize process, particles will enter into the EUV pod with nitrogen. This is the reason why the particle removal efficiency of the vacuum system is worse.
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