| Summary: | 碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系碩士班 === 102 === The FOUP plays an important role for contamination control. Wafer and FOUP may be contaminated during the manufacturing processes. An example is that after the processes of etching, the contaminant, as a form of airborne molecular contaminant (AMC), may evaporate, deposit, and contaminate wafers in the later processes. The deposited AMC may, again, evaporate and deposit on the wafer. A laser flow visualization system was used to study the flow patterns when FOUP door is in the open process. Results show that in the instance when the FOUP door is just opening, the downward flow from FFU was toward to the upper part of the FOUP. The downward flow becomes toward to the FOUP in the lower part and outward in the upper part of the FOUP when door was wholly opened. Very low downward velocity of FFU case exhibits an incomplete outward flow pattern. For FOUP with inject plenum, when the FOUP door is closed, the collision of air jet from the inject plenum and the invading airflow from mini-environment forms the turbulence between the gaps of wafers. The air jet from the inject plenum pushes the air inside FOUP towards the mini-environment as the FOUP door is opened.
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