Thermal Expansion Analysis of Vertical Probe Cardand Measures of Expansion Reduction

• Main Authors: Chan-Kuei Hsu, 許展魁
• Other Authors: Jung-Tang Huang
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/t8z6sm

碩士 === 國立臺北科技大學 === 機電整合研究所 === 102 === Thanks to the continuously improving manufacture technology in semiconductor industry, the dimension of ICs is shrinking, which makes smaller size of portable device possible, and lead the proliferation of portable device. Following the increasing demand of ICs, semiconductor makers need to increase the production, and, at the same time, maintain the yield rate. To keep high yield rate, having a high accuracy of wafer-inspection is becoming more critical. Finding defected wafer before delivery can reduce the cost of callback of products in the future. Under the trend of smaller size of ICs and test pad on wafer, how to increase accuracy of inspection is certainly one key factor of cost down. From the discussion of height-variation on z-axis and of position-accuracy on xy-plane in the paper, changing the shape of stiffening ring on probe card, and changing the material of permanent seat can achieve the highest inspection accuracy. In the paper, discussions also focus on the fact that temperature drop of probe while pausing the inspection causes probe shrink. Solutions of avoiding shrinkage of probe are found, and cost caused by inaccurate inspection will be saved.