Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components

• Main Authors: Zih-Sia Hong, 洪滋霞
• Other Authors: 黃乾怡
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/sr7w2d

碩士 === 國立臺北科技大學 === 工業工程與管理系碩士班 === 102 === As the environmental awareness continues to rise, the issue of green package is serious importance. While the traditional solder reflow process is replaced by the lead free process, the reflow temperature will raise to 260℃. Because the component and board warpage emerge in high temperature, the tolerance between component and board increases. The phenomenon creates open joint to influence the yield. The design of experiments and trial and error are typically used to determine the desired process parameters and resulted assembly yield. Nevertheless, there are several factors involved and samples are limited for conducting the experimentation. Therefore, the simulation methodology that is a low cost program alternates conventional experiment methodology. The BGA, QFP, DFN-8 components of the server product are under considerate. After this research considers the assembly process parameters, component variations, component and board warpage, establishing the prediction model of the open joint. Monte Carlo simulation technique was used to predict the solder joint yield. And then sensitivity analysis determines the sequence of improvement parameters. After the reflow procedure, the simulated results of component yield that include 0.8 Pitch BGA, 1.0 Pitch BGA, QFP and DFN-8 are 99.99904%, 99.9999%, 99.99996% and 100%. The open scenario in the assembly of electronic components is 98.6576%. The sequence of adjustment process parameter is the average of printed soldering paste thickness, the depth that solder ball fall into solder paste percentage of pick-and-place, the specification limiter of the solder ball and the standard deviation of solder paste.