| Summary: | 碩士 === 大華科技大學 === 機電研究所 === 102 === This study proposes an ACF (Anisotropic conductive film) manufacturing process combining fine-metal-wire precision winding with laminating technology. The contact force and resistance of the ACF are measured. A finite element analysis model was established to simulate the measurement, and was used to explain the variation of measured values. In addition, this study also assembled an ACF probe card for Echo IC testing to verify the feasibility. Results show that an ACF with 30 mm(Length) × 30 mm(Width) × 1 mm(Thick) could be successfully produced, in which the diameter of fine metal wire is 25 μm, pitch is 50 μm. While the overdrive is less than 50 μm, the "balanced contact force" of the ACF is 5.2 ~ 15.7 gf / mil. If the overdrive is greater than 50 μm, the contact force is saturated. The saturation value is about 12.5 ~ 25 gf. From the finite element simulation, it could be deduced that the variation of measured values results from the "needle tip offset relative to fine copper wire." The stable "signal path resistance" of the ACF is about 23.5 ~ 26 mΩ. The assembled ACF probe card could successfully carry out functional testing on Echo IC, test yield was up to 90% out from 500 tests.
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