Ultrasonic Demolding System without Knock-out Pin

• Main Authors: Jheng-Dao Wu, 吳政道
• Other Authors: Chung-Chih Lin
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/ndek45

碩士 === 國立虎尾科技大學 === 機械與電腦輔助工程系碩士班 === 102 === In injection molding process, knock-out pins will leave ejector marks on the parts. While fabricating micro-structured components, the pins for normal ejector system are usually larger than the micro-structured ones. It would leave marks in ejection process and it would even destroy the exterior of micro-structured components sometimes. In order to avoid this situation, as a result, this research is to utilize Comsol to simulate the natural frequency and the modal shape of the Langevin transducer, and make use of Smooth Impact Drive Mechanism (SIDM) to design the actuator to eject the injection parts. The mold equipped with the double-layer Langevin transducer could eject the parts without knock-out pins in the plastic injection molding process.