Electrochemical Atomic Layer Deposition of Cu-Ru Film
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 102 === Preparation of the atomic layer films by an electrochemical atomic layer deposition (ECALD) can solve step coverage issues. This technique can also be used to prepare copper alloy films for semiconductor process. This study presents copper (Cu) films d...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9av6wk |