Optimization of Cu Pillar Bumping Process for Probing Mark in Al Pad
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 102 === Wafer test procedure have 2 types that are pre-bumping and post-bumping. However, pre-bumping induce probing mark in Al pad. The probing mark would impact adhesion issue for wire bounding process. So, Al pad of roughness can effect bump strongth...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09726688795380845859 |