Study on Diamond Dressing of Soft and Ductile Polyurethane Pad
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === Because of rapid development of new technology, the wafer size has been enlarged from 12 to 18 inch in near future, and the semiconductor products have become essential for industry. With the decreasing of line width of integrated circuit, chemical mechanical pl...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/00633504062852521370 |