Analysis on Effective Lifetime Index of Polishing Pad for CMP Process of Monocrystalline Silicon Wafers and Sapphire
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === Since ancient times, polishing has been a process critical to bronze mirrors, jade and jewelry grinding until modern wafer planarization in semiconductor industry’s. However, mechanical polishing has certain limitation, the chemical mechanical planarization (CMP...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32497829840515040968 |