Development of an Electrical Kinetic-Force Assisted Chemical Mechanical Planarization (EKF-CMP) for Functional Wafer Planarization
碩士 === 國立臺灣科技大學 === 機械工程系 === 102 === Three-dimensional stacking integrated circuit (3DS-IC) is considered to be a key technology to break through the limitations of Moore's law. The main technology is using the silicon or glass substrate with via which called through silicon via (TSV) and...
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| Format: | Others |
| Language: | zh-TW |
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2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36639591151287463271 |