Effect of joint thickness on void formation and intermetallic compound dissolution for Pb-free solders during electromigration
碩士 === 國立清華大學 === 工程與系統科學系 === 102 === Under the rapid development of consumer electronics products, the packaging technique had also improved in order to meet the demand for high performance, small size and multi-function. In the flip chip packaging technology, it provides more I/O counts with same...
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| Format: | Others |
| Language: | en_US |
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2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64539470608593757842 |