Enhanced electromigration resistance of Pb-free solders by using Cu/Sn composite structure

碩士 === 國立清華大學 === 工程與系統科學系 === 102 === Electromigration induced failure has been regarded as a serious reliability issue in the Pb-free electronic packaging application. Due to the unique bump-to-line configuration in solder joints, the dominant failure mechanism has been reported as pancake-type vo...

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Bibliographic Details
Main Authors: Lin, Shih-Hsun, 林士勛
Other Authors: 歐陽汎怡
Format: Others
Language:en_US
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/30428960024274654753

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