DfT Architecture and Interconnect Defect Diagnosis and Repair for Interposer-Based 3D-ICs
博士 === 國立清華大學 === 電機工程學系 === 102 === Through-Silicon Vias (TSVs) are high-density vertical interconnects between dies and they enable the creation of three-dimensional Integrated Circuits (3D-ICs) having higher performance and lower power consumption than traditional 2D-ICs. Currently, a practical T...
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| Format: | Others |
| Language: | en_US |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18145558699781333102 |