A study of 3D Twin-bit Via RRAM by 28nm Cu Backend Process

碩士 === 國立清華大學 === 電子工程研究所 === 102

Bibliographic Details
Main Author: 秦永文
Other Authors: 林崇榮
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/22956380886723652061