Improve Delamination Problem of NanD Flash IC Package By Using Six Sigma Methodology

• Main Authors: Chu, Kai-Min, 朱凱民
• Other Authors: Su, Chao-Ton
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/50159115898265274242

碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 102 === Nand Flash is regarded as a typical semiconductor memory unit. In recent years, customers’ increasing demands for “Smart phone” and :Tablet computer” give rise to a rapid expansion of the markets.Under such circumstances, along with very limited time and resources, the semiconductor assembly and testing industry still needs to make more products of quality and diversity, and simultaneously, satisfy customers’ needs and meet the qualification requirement. Six Sigma is generally believed to be an effective way to enhance an enterprise’s quality and competitiveness. This research is to investigate a semiconductor assembly and testing house, which improved the IC delamination and succeeded in raising customer satisfaction rating. This company adopted the Six Sigma approach, define, measure, analyze, improve and control to assess the products qualities and make a holistic improvement. Secondly, the research also scrutinizes the factors of quality control with the aid of statistics. It uses Taguchi Methods to control the variables to attain the best result. After being tested and monitored for a long period of time, the occurrence of delamination was prevented. This result saved the company nearly NT50 million dollars and the rating of customer satisfaction is also raised substantially.