DIC on the Thermal Expansion Coefficient Measurements of Palladium at Different Temperature Levels
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 102 === In traditional IC packaging, wire bonding is typically performed using gold. In recent years, increasing gold prices have motivated the packaging industry actively to develop copper wire bonding technology. Coating copper wire bonding with palladium can pre...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2014
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| Online Access: | http://ndltd.ncl.edu.tw/handle/njrnea |